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学术报告:半导体封装技术简介与发展

题目:半导体封装技术简介与发展

报告人:林挺宇博士(国家“千人计划”特聘专家)

时间:2017年9月15日上午10:00-12:00

地点:大学城校园工学2号馆二楼学术报告厅

欢迎广大师生参加!

 

报告摘要:

半导体先进封装3D,2.5D,TSV 及扇出技术综述的演讲全面介绍近些年先进封装技术的重要方面,如专利,技术种类,供应链发展及全球市场发展的情况。同时,华进半导体及国内封装厂在扇出技术研发方面也得到了重点的全面的介绍和展示,扇出技术的产业化在2016年后,特别是台积电为苹果iPhone7 生产出A10 处理器后,其技术特点是INFO 的扇出技术在手机中得到了广泛应用。今后几年随着晶圆级和扳机扇出技术的发展,这项技术对市场的影响会更积极地展现出来。

 

报告人介绍:

林挺宇,博士,清华大学(BS)新加坡国立大学 (Ph.D)阿德莱德大学(MBA2014入选国家“千人计划”获得摩托罗拉认证的6Sigma质量黑带,发表论文百余篇,国际专利数十项先后任职于飞利浦、朗讯、摩托罗拉、新加坡微电子所,任职于华进半导体封装先导技术研发中心有限公司,担任技术总监(扇出型封装工艺、材料、可靠性与失效分析方向)、战略研究与产业化部长

Dr. Lin Tingyu has more than twenty years of experience in design, process, assembly, reliability and equipment development in electronics packaging, semiconductor, consumer electronics, PCBA, thermal and aerospace industry.  He received a B.E. degree in thermal engineering from Tsing Hua University and a M.E degree in aerospace engineering from the Ministry of Aerospace in 1990 in China and a Ph.D in microelectronics from National University of Singapore (NUS) in 1997. He is a Motorola (Google) certified Six Sigma Black Belt in 2012. From 2013 to present, he has been a technical Director of the National Centre for Advanced Packaging (NCAP), China. He is responsible for strategy planning, organizing consortium, and leading R&D activities on advanced packaging material and equipment for the development and commercialization of fan out, TSV, and 2.5D process solutions.  From 2012-2013 he was a program director of the Institute of Microelectronics, Singapore (IME), and responsible for 2.5D, fan-out, and WLP development. From 1997-2012 he worked as a senior manager in Philips, Lucent Technologies (previously AT&T Bell Lab) and Motorola Electronics. where he was responsible for consumer electronics design, process and product development, and advanced manufacturing in advanced IC packaging in flip chip module and SiP, and supply chain management and mobile product quality and reliability improvement.  He has been engaged in more than 100 product design & process development in mobile module, IC component, and consumer electronics, etc.  Dr. Tingyu had published 150 papers and filed more than 10 patents. In addition to receiving many excellent paper awards and providing keynote talks at several conferences, he drove and passed two international ASTM sputtering material standards(F3166 & F3192)for TSV development. He received several Motorola Innovation awards in 2008。

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