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张凯 教授

 

一、个人简述(限300字)

张凯博士于香港科技大学获得哲学博士学位,曾任西安交通大学副教授,香港科技大学副研究员、访问学者,承担科研与中英文教学工作。现任广东工业大学“百人计划”特聘教授。在半导体先进封装、LED固态照明封装及散热管理、石墨烯纳米材料、微电子制造工艺及可靠性分析等领域拥有十几年专业经验。主持香港创新科技署粤港科技合作项目、大学与产业合作项目等,获得企业及政府近800万港币经费资助。参与研发机构、科研平台建设,参与筹建香港科技大学佛山LED工程中心。参与成立初创公司,并获得天使投资。具有丰富的科研、技术转移及产业合作经验。合作发表美国、中国专利共4个,著作2本(各一章),国际学术论文50多篇。

 

二、学科领域

先进半导体封装、LED固态照明封装及散热管理,石墨烯、纳米材料及其在新能源中的应用,有限元、分子动力学仿真等

 

三、教育背景

2003.08-2008.08 香港科技大学,机械工程,获哲学博士学位;

1993.09-1996.06西安交通大学,热能工程,获工学硕士学位;

1987.09-1991.07 西安交通大学,电厂热能动力工程,获工学学士学位。

 

四、工作经历

2016.08-至今 广东工业大学,“百人计划”特聘教授

2008.09-2016.07 香港科技大学,副研究员/访问学者

2002.08-2016.07 西安交通大学,副教授

1996.07-2002.07西安交通大学,讲师

1991.07-1993.08西安交通大学,辅导员

 

五、学术兼职

国际著名期刊审稿人:Carbon, Thermochimica Acta, Computational Materials Science, Journal of Experimental Nanoscience, International Journal of Heat and Mass Transfer, IEEE transactions on Components, Packaging and Manufacturing Technology, Journal of Nanomaterials等

 

六、主要荣誉

  1. 第55届电子元件技术国际会议 (ECTC),摩托罗拉/ IEEE元件封装与制造技术学会CPMT研究生奖,
  2. 第7届电子封装技术国际会议 (ICEPT), 飞利浦最佳论文奖,
  3. 第12届电子封装技术国际会议 (ICEPT), 飞利浦杰出论文奖。
  4. 香港科技大学研究生奖学金

 

七、代表性论文

  1. Bo Zhao, Yi-Tao Xu, Sheng-Yun Huang, Kai Zhang, Matthew M.F. Yuen, Jian-Bin Xu, Xian-Zhu Fu, Rong Sun, Ching-Ping Wong, “3D RGO frameworks wrapped hollow spherical SnO2-Fe2O3 mesoporous nano-shells: Fabrication, characterization and lithium storage properties”, Electrochimica Acta, Vol.202, pp. 186-196, 2016
  2. Bo Zhao, Tao Wang, Li Jiang, Kai Zhang, Matthew M.F. Yuen, Jian-Bin Xu, Xian-Zhu Fu, Rong Sun, Ching-Ping Wong, “NiO mesoporous nanowalls grown on RGO coated nickel foam as high performance electrodes for supercapacitors and biosensors”, Electrochimica Acta, Vol.192, pp.205-215, 2016
  3. Bo Zhao, S.Y. Huang, Tao Wang, Kai Zhang, Matthew M.F. Yuen, J.B. Xu, X.Z. Fu, Rong Sun, C.P. Wong, “Hollow SnO2&Co3O4 core-shell spheres encapsulated in three-dimensional graphene foams for high performance supercapacitors and lithium-ion batteries”, Journal of Power Sources, Vol.298, pp.83-91, 2015
  4. Tao Wang, Bo Zhao, Hong Jiang, Hai-Peng Yang, Kai Zhang, Matthew M. F. Yuen, Xian-Zhu Fu, Rong Sun and Ching-Ping Wong, “Electro-deposition of CoNi2S4 flower-like nanosheets on 3D hierarchically porous nickel skeletons with high electrochemical capacitive performance”, J. Mater. Chem. A, Vol.3, pp.23035-23041, 2015
  5. Sheng-Yun Huang, Bo Zhao, Kai Zhang, Matthew M.F. Yuen, Jian-Bin Xu, Xian-Zhu Fu, Rong Sun, Ching-Ping Wong, “Enhanced reduction of graphene oxide on recyclable copper foils to fabricate graphene films with superior thermal conductivity”, Scientific Reports 5, Article number: 14260, 2015
  6. Ying Guo, Ling Zhang, Bo Zhao, Kai Zhang, Matthew M.F. Yuen, Jian-Bin Xu, Xian-Zhu Fu, Rong Sun, Ching-Ping Wong, “A novel solid-to-solid electrocatalysis of graphene oxide reduction on copper electrode”, RSC Advances, Vol.5, pp. 87987-87992, 2015
  7. Yi-Tao Xu, Ying Guo, Le-Xing Song, Kai Zhang, Matthew M. F. Yuen, Jian-Bin Xu, Xian-Zhu Fu, Rong Sun, and Ching-Ping Wong, “Co-reduction self-assembly of reduced graphene oxide nanosheets coated Cu2O sub-microspheres core-shell composites as lithium ion battery anode materials”, Electrochimica Acta, Vol. 176, pp. 434-441, 2015
  8. Zhaoli Gao, Xinfeng Zhang, Kai Zhang, Matthew Yuen, "Growth of Vertically Aligned Carbon Nanotube Arrays on Al Substrates Through Controlled Catalyst Diffusion", The Journal of Physical Chemistry C, Vol. 119, pp.15636-15642, 2015
  9. Huming Ren, Ying Guo, Sheng-Yun Huang, Kai Zhang, Matthew MF Yuen, Xianzhu Fu, Shuhui Yu, Rong Sun, Ching Ping Wong, “One-step preparation of silver hexagonal micro-sheets as electrically conductive adhesive fillers for printed electronics”, ACS Applied Materials & Interfaces, Vol. 7, pp. 13685-13692, 2015
  10. Ying Guo, Yi-Tao Xu, Bo Zhao, Tao Wang, Kai Zhang, Matthew M. F. Yuen, Xian-Zhu Fu, Rong Sun, Ching-Ping Wong, "Urchin-like Pd@CuO-Pd Yolk-shell Nanostructures: Synthesis, Characterization and Electrocatalysis", J. Mater. Chem. A, Vol. 3, pp. 13653-13661, 2015, Front cover
  11. Hu-Ming Ren, Kai Zhang, Matthew Yuen, Xian-Zhu Fu, Rong Sun, Ching-Ping Wong, “Preparation and performance of Ag-coated Cu flakes filled epoxy as electrically conductive adhesives”, Journal of Solid State Lighting, Vol.1, Article No.10, 2014
  12. Yi-Tao Xu, Ying Guo, Le-Xing Song, Kai Zhang, Matthew M. F. Yuen, Xian-Zhu Fu, Rong Sun and Ching-Ping Wong, “Facile fabrication of reduced graphene oxide encapsulated copper spherical particles with 3D architecture and high oxidation resistance”, RSC Adv., Vol.4, pp.58005-58010, 2014
  13. Sheng-Yun Huang, Kai Zhang, Matthew M. F. Yuen, Xian-Zhu Fu, Rong Sun and Ching-Ping Wong, “Facile synthesis of flexible graphene-silver composite papers with promising electrical and thermal conductivity performances”, RSC Adv., Vol.4, pp.34156-34160, 2014
  14. Xinfeng Zhang, Kan Kan Yeung, Zhaoli Gao, Jinkai Li, Hongye Sun, Huansu Xu, Kai Zhang, Min Zhang, Zhibo Chen, Matthew M.F. Yuen, Shihe Yang, “Exceptional thermal interface properties of a three-dimensional graphene foam”, Carbon, Vol.66, pp.201-209, 2014
  15. Xinfeng Zhang, Honye Sun, Chen Yang, Kai Zhang, Matthew M. F. Yuen, “Highly conductive polymer composites from room temperature ionic liquid cured epoxy resin: effect of interphase layer on percolation conductance”, RSC Adv., Vol.3, pp.1916-1921, 2013
  16. Xinfeng Zhang, Kai Zhang, Min Zhang, Chen Yang, Hongye Sun, Matthew M. F. Yuen, “Highly conductive die attach adhesive from percolation control and its applications in light emitting device thermal management”, Appl. Phys. Lett., Vol.102, 014101, 2013
  17. Zhaoli Gao, Kai Zhang, M. M. F. Yuen, “Fabrication of carbon nanotube thermal interface material on aluminum alloy substrates with low pressure CVD”, Nanotechnology, Vol.22, 265611, 2011
  18. Chong Li, Hai-Bo Fan, Kai Zhang, Matthew Yuen, and Zhigang Li, “Flow dependence of interfacial thermal resistance in nanochannels”, Journal of Chemical Physics, Vol.132, 094703, 2010
  19. H.B. Fan, Kai Zhang, Matthew M.F. Yuen, “The interfacial thermal conductance between a vertical single-wall carbon nanotube and a silicon substrate”, Journal of Applied Physics, Vol.106, 034307, 2009
  20. Kai Zhang, Y Chai, Matthew M.F. Yuen, David G.W. Xiao, Philip C.H. Chan, “Carbon nanotube thermal interface material for high-brightness light-emitting-diode cooling”, Nanotechnology, Vol.19, 215706, 2008
  21. Kai Zhang, Matthew M.F. Yuen, J.H. Gao, B. Xu, “Fabrication of High Thermal Conductivity Carbon Nanotube Arrays by Self Assembled Fe3O4 particles”, CIRP Annals, Vol.56, pp. 245-248, 2007
  22. Yang Chai, Jingfeng Gong, Kai Zhang, Philip C H Chan and Matthew M.F. Yuen, “Flexible transfer of aligned carbon nanotube films for integration at lower temperature”, Nanotechnology, Vol.18, pp.355709, 2007
  23. Kai Zhang, Jie Li, Xinfeng Zhang, Matthew M. F. Yuen, Lisa Liu, Yuhua Lee, Cheng Sheng Ku, Chuiming Wan, Zhaoming Zeng, Guowei David Xiao, “Highly Thermal Conductive Transparent Die Attach Material for LEDs”, 17th Electronic Packaging Technology Conference (EPTC), Singapore, 2-4 Dec., 7412390, 2015, oral presented
  24. Sheng-Yun Huang, Kai Zhang, Matthew MF Yuen, Xian-Zhu Fu, Rong Sun*, CP Wong, “Graphene-Ag composite film as thermal interface materials”, 16th International Conference on Electronic Packaging Technology (ICEPT), pp. 574-575, Changsha, China, 11-14 Aug., 2015
  25. Bo Zhao, Kai Zhang, Matthew M.F. Yuen, Fu Xianzhu, Rong Sun* and Ching-Ping Wong, “Electrochemically exfoliated graphene for applications in thermal and electrical conductions”, 16th International Conference on Electronic Packaging Technology (ICEPT), pp.253-255, Changsha, China, 11-14 Aug., 2015
  26. Xie Jinqi, Ren Huming, Zhang Kai, Yuen Matthew M.F., Lee Ricky S.V., Fu Xianzhu, Sun Rong and Wong Chingping, “Thermally conductive adhesives based on silver coated copper flake fillers”, 16th International Conference on Electronic Packaging Technology (ICEPT), accepted, Changsha, China, 11-14 Aug., 2015
  27. Zhihua Cao, Kai Zhang, Guoping Zhang, Matthew M.F. Yuen, Ping Gu, Xianzhu Fu, Rong Sun*, and C.P. Wong, “High Performance Phase Change Thermal Interface Materials Based on Porous Graphitic Carbon Spheres-Paraffin Wax Composite”, 64th IEEE Electronic Components and Technology Conference (ECTC), pp. 464-469, San Diego, CA, USA, 27-30 May, 2014
  28. Jie Li, Kai Zhang*, Xinfeng Zhang, Matthew Ming-Fai Yuen, Lisa Liu, Cheng Sheng Ku, “Enhancing the Thermal Conductivity of Silicone Composites by Increasing Crosslink Degree”, 15th International Conference on Electronic Packaging Technology (ICEPT), pp.329-333, Chengdu China, 12-15 Aug., 2014
  29. Kai Zhang, Xinfeng Zhang, Zhibo Chen, Hongye Sun, Matthew M. F. Yuen, Cheuk Yan Chan, Yuhua Lee, Lisa Liu, Sean ho, Guoqi Zhang, “Thermal improvement of die attach by using PDMS-grafted particles as filler and Its application in solid state lighting”, 14th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp.146-152, Wroclaw, Poland, 14-17 April, 2013, oral presented
  30. Zhi Zhang, Xiaoliang Zeng, Ling Zhang, Pengli Zhu, Kai Zhang, Xianzhu Fu, Rong Sun*, Matthew M.F. Yuen, and C.P. Wong, “Ag modified carbon nanotubes as filler for thermal interface materials”, 14th International Conference on Electronic Packaging Technology (ICEPT), pp.301-303, Dalian, China, 11-14 Aug., 2013
  31. Ling Zhang, Zhi Zhang, Pengli Zhu, Kai Zhang, Xianzhu Fu, Rong Sun*, Matthew M. F. Yuen, and C.P. Wong, “Effect of wetting agent on the properties of thermal grease with Al based fillers”, 14th International Conference on Electronic Packaging Technology (ICEPT), pp. 304-307, Dalian China, 11-14 Aug., 2013
  32. Min Zhang, Kai Zhang, Xinfeng Zhang, Chen Yang, Matthew M. F. Yuen, “Transparent Functionalized Zinc Oxide/Epoxy Nanocomposite with High Thermal Performance for High-Power Light-Emitting Diodes”, 14th International Conference on Electronics Materials and Packaging (EMAP), pp.277-282, Hong Kong, 13-16 Dec., 2012
  33. Kai Zhang, Xinfeng Zhang, Min Zhang, Chen Yang, Hongye Sun, Matthew M. F. Yuen, Barry Zhong, Aernout Reints Bok, Lisa Liu, Cheuk Yan Chan, Guoqi Zhang, “Thermal Improvement of Die Attach with Iodine Treatment and Its Application in Solid State Lighting”, 13th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp.231-234, Cascais, Portugal, 16-18 April, 2012, oral presented
  34. Kai Zhang, Xinfeng Zhang, Barry Zhong, Chen Yang, Zhaoli Gao, Hongye Sun, Matthew Yuen, Aernout Reints Bok, Guoqi Zhang, “High Thermal Performance Die Attach with Iodine Treatment for Solid State Lighting”, 8th China International Forum on Solid State Lighting, pp.190-198, Guangzhou, China, 2011, oral presented
  35. Kai Zhang, David G.W. Xiao, Xiaohua Zhang, Haibo Fan, Zhaoli Gao, Matthew M. F. Yuen, "Novel Cooling Solutions for LED Solid State Lighting”, 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT&HDP), pp.1128-1132, Shanghai, China, 8-11 Aug., 2011, oral presented, Award: Philips Outstanding Paper
  36. Zhaoli Gao, Kai Zhang, M. M. F. Yuen, “Performance of High-Brightness LEDs with VACNT-TIM on Aluminum Heat Spreaders”, 61th IEEE Electronic Components and Technology Conference (ECTC), pp.1631-1635, Orlando, FL, USA, 2011
  37. Kai Zhang, Haibo Fan, David Guowei Xiao, Zhaoli Gao, Xiaohua Zhang, Matthew M. F. Yuen, “Thermal Performance of LED Packages for Solid State Lighting with Novel Cooling Solutions”, 12th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp.121, Linz, Austria, 18-20 April, 2011, oral presented, Keynote
  38. Zhaoli Gao, Kai Zhang, M. M. F. Yuen, “The applications of CNTs as TIM and microfins in thermal management of electronic packages”, AMD Technical Forum and Exhibition 2010, Taiwan, 19 October, 2010
  39. Zhaoli Gao, Kai Zhang, M. M. F. Yuen, “Fabrication of carbon nanotube thermal interface material on aluminium alloy substrates”, 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), pp. 1401-1408, Xi’an, China, August 16-19, 2010
  40. Kai Zhang, Matthew M.F. Yuen, David G.W. Xiao, Y.Y. Fu, Philip C.H. Chan, “Directly Synthesizing CNT-TIM on Aluminum Alloy Heat sink for HB-LED Thermal Management”, 58th IEEE Electronic Components and Technology Conference (ECTC), pp.1659-1663, Orlando, FL, USA, 27-30 May, 2008, oral presented
  41. H.B. Fan, Kai Zhang, Matthew M.F. Yuen, “Investigation of Thermal performance of carbon nanotube under external mechanical stresses and moisture”, 8th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp.20-23 , London, 16-18 April, 2007
  42. H.B. Fan, Kai Zhang, Matthew M.F. Yuen, “Thermal performance of carbon nanotube based composites investigated by molecular dynamics simulation”, 57th IEEE Electronic Components and Technology Conference (ECTC), pp.269-272, Reno, USA, 29 May-1 June, 2007
  43. Yang Chai, Jingfeng Gong, Kai Zhang, Philip C.H. Chan and Matthew M.F. Yuen, “Low Temperature Transfer of Aligned Carbon Nanotube Films Using Liftoff Technique”, 57th IEEE Electronic Components and Technology Conference (ECTC), pp.429-434 , Reno, USA, 29 May-1 June, 2007
  44. Yang Chai, Kai Zhang, Min Zhang, Philip C.H. Chan and Matthew M.F. Yuen, “Carbon Nanotube/ Copper Composites for Via Filling and Thermal Management”,57th IEEE Electronic Components and Technology Conference (ECTC) , pp.1224-1229, Reno, USA, 29 May-1 June, 2007
  45. David G. W. Xiao, Kai Zhang, Matthew M.F. Yuen, “Thermal management solutions with carbon nanotubes for high brightness LED”, China International Solid State Lighting Forum & Exhibition (CHINASSL), Shanghai, China, 2007
  46. Kai Zhang, Matthew M.F. Yuen, "Heat spreader with aligned CNTs designed for thermal management of HB-LED packaging and microelectronic packaging”, 7th International Conference on Electronic Packaging Technology (ICEPT), pp.479-482, Shanghai, China, 26-29 Aug., 2006, oral presented, Award: Philips Best Paper
  47. Kai Zhang, Matthew M.F. Yuen, N. Wang, J.Y. Miao, David G.W. Xiao, H.B. Fan, “Thermal Interface Material with Aligned CNT and Its Application in HB-LED Packaging”, 56th IEEE Electronic Components and Technology Conference (ECTC), pp.177-182, San Diego, CA, USA, 30 May-2 June, 2006, oral presented
  48. Kai Zhang, H.B. Fan, Matthew M.F. Yuen, “Molecular dynamics study of the thermal conductivity of CNT-array-thermal interface material”, 8th International Conference on Electronics Materials and Packaging (EMAP), pp.113-116, Hong Kong, 11-14 Dec., 2006, oral presented
  49. H.B. Fan, Kai Zhang, Matthew M.F. Yuen, “Effect of defects on thermal performance of carbon nanotube investigated by molecular dynamics simulation”, 8th International Conference on Electronics Materials and Packaging (EMAP), pp 451-454, Hong Kong, 11-14 Dec., 2006
  50. Matthew M.F. Yuen, Kai Zhang, Haibo Fan, “CNT-Based Thermal Interface Material”, International Seminar on LEDs, Display, and Lighting 2007, Seoul, Korea, 2007
  51. Kai Zhang, David G. W. Xiao, Cell K.Y. Wong, H.W. Gu, Matthew M.F. Yuen, Philip C.H. Chan, Bing Xu, “Study on Thermal Interface Material with Carbon Nanotubes and Carbon Black in High¬ Brightness LED Packaging with Flip¬ Chip”, 55th IEEE Electronic Components and Technology Conference (ECTC), pp.60-65, Orlando, FL, USA, 31 May-4 June, 2005, oral presented, Award: 2005 Motorola/IEEE CPMT Graduate Student Fellowship for Research on Electronic Packaging

 

八、主要著作

  1. Kai Zhang, Matthew M.F. Yuen, “Thermal stresses in LED packages for solid state lighting” in book “Encyclopedia of Thermal Stresses”, published by Springer, pp.5378-5394, 2013
  2. H Fan, Kai Zhang, Matthew M.F. Yuen, “Thermal Conductivity of Carbon Nanotube Under External Mechanical Stresses and Moisture by Molecular Dynamics Simulation”, in book “Molecular Modeling and Multiscaling Issues for Electronic Material Applications”, published by Springer, pp.93-99, 2012

 

九、科研项目

  1. 广州市产学研协同创新重大专项对外科技合作专题项目,(已获批,但尚未有批准号,申请号201605130805172),基于高性能热电制冷及纳米流体微通道的高密度超大功率LED散热技术的开发,2017/5/1-2020/4/30,200万元,在研,参与
  2. 广东工业大学“百人计划”(特聘教授)项目,220418106,电子封装、第三代半导体系统及新型材料研究,2016/08-2021/07,100万,在研,主持
  3. 香港创新科技署大学与產业合作计划项目,UIM/241,高导热性能固晶材料及其在LED照明系统中的应用,2013/6/1-2015/8/15,312.8万元港币,已结题,主持
  4. 香港政府大学教育资助委员会(UGC)项目,RPC10EG22,3D Packaging with Silicon Chip Carriers and Through Silicon Vias for System-in-Package,2010/6/1-2012/5/31,49.9万元港币,已结题,参与
  5. 香港创新科技署粤港科技合作计划项目,GHP/035/07GD,大功率 LED 封装材料和制造技术,2008/9/1-2010/8/31,457.9万元港币,已结题,主持
  6. 香港研究资助委员会(RGC)资助项目,621907,MD design and AFM evaluation of SAM structures as adhesion promoter for electronic packages,2007/9/1-2010/2/28,45.8万元港币,已结题,参与
  7. 美国电子元件与技术国际会议(ECTC)颁发的“Motorola-IEEE/CPMT电子封装”研究生奖金项目,IEEE06/07.EG01,Carbon Nanotube Thermal Interface Material and Its Application in High Brightness LED Packages, 2006/5/1-2008/4/3, 16.4万元港币,已结题,全面负责

 

十、知识产权

  1. Matthew M.F. Yuen, Kai Zhang, US patent 8890312: Heat Dissipation Structure with Aligned Carbon Nanotube Arrays and Methods for Manufacturing and Use, 2014
  2. Matthew M. F. Yuen, Xinfeng Zhang, Kan Kan Yeung, Zhaoli Gao, Kai Zhang, Min Zhang, Huansu Xu, US patent US20140110049: Three-Dimensional Interconnected Porous Graphene-Based Thermal Interface Materials, 2014
  3. Matthew M.F. Yuen, Kai Zhang, Chinese patent 200710106382.6: 具有排列整齐的碳纳米管阵列的散热结构及其制造和应用,2007
  4. Matthew M.F. Yuen, Kai Zhang, Hong Kong patent HK 1115231:具有排列整齊的碳納米管陣列的散熱結構及其製造和應用, Heat dissipation structure with aligned carbon nanotube arrays and method for manufacturing same and use thereof, 2014

 

十一、联系方式

办公地点:广东工业大学大学城校园工学2号馆机电工程学院

通信地址:广州市番禺区广州大学城外环西路100号

邮政编码:510006

联系电话:13826291297

电子邮箱: mezhangk@qq.com

 

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