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材料断口定量分析学术报告

报告题目:材料断口定量分析学作为失效分析的工具

报告人:Mecholsky博士

时间:6月14日(星期二)下午2:00-3:30

地点:大学城校园工学二号馆205机电工程学院会议室

报告人简介:

Dr. John J. (Jack) Mecholsky, Jr., Ph.D, is a Professor at the University of Florida in the Materials Science and Engineering Department. He is a Fellow of the American Ceramic Society (ACerS). He served on the Board of Directors of the American Ceramic Society from 2006 to 2009. He is known as an international expert in the fractographic analysis of brittle materials. He also served as the Associate Director for Materials at the Office of Naval Research in London (UK) and as a Guest Researcher at the National Institute for Standards and Technology and at the Cavendish Laboratory in Cambridge University. He won the Teacher of the Year Award in 2006 and the Graduate Advisor of the Year Award in 2009. He developed new fractographic techniques used in the failure analysis of optical fibers, of infrared transmitting radome materials, and of ferroelectrics. He also developed equations for the analysis of failure by laser irradiation of ceramic materials. He holds patents for the development of a laser hardened composite material and a bioactive tapecast multi-layer ceramic/metal composite. He has published over 200 technical papers and is the co-author of “Fracture of Brittle Materials: Testing and Analysis” (Wiley Pub. 2012).

                    Quantitative Fractography As A Tool for Failure Analysis

                                       J. J. Mecholsky

                      Department of Materials Science and Engineering

                                   University of Florida

                                    Gainesville, FL USA

Quantitative Fractography combines the principles of fracture mechanics with the observations on the fracture surfaces of materials that fail in a brittle manner. As such, we can develop equations that relate the crack size and the surrounding regions during fracture to the strength of the material. In addition, this analytical approach is able to distinguish cracks with residual stress and those without residual stress. The tools developed through the use of Quantitative Fractography also allow us to determine the existence or not of slow crack growth due to environmental conditions. The existence of mixed mode loading during fracture can also be detected. The application of Quantitative Fractography will be demonstrated through examples of forensic analysis in research, processing and production.

 

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